6th Asia-Pacific International Symposium
on Advanced Reliability and Maintenance Modeling (APARM2014)

21– 23 August 2014, Sapporo, Hokkaido, Japan

Recent Developments on Reliability, Maintainability and Dependability

Journal of Risk and Reliability

Call for Papers


Special Issue on APARM 2014

Journal of Risk and Reliability (JRR):

Proceedings of the Institute of Mechanical Engineers Part O(SAGE)

Corrosion Abstracts, Engineered Materials Abstracts, Inspec, Mechanical & Transportation Engineering Abstracts, Mechanical Engineering Abstracts, Metals Abs./METADEX, Science Citation Index Expanded (SCIE)

SCOPE: The 2014 Asia-Pacific International Symposium on Advanced Reliability and Maintenance Modeling (APARM 2014) will be held in Sapporo, Hokkaido, Japan, August 21-23, 2014. Based on the outstanding papers presented at the conference, we plan to edit a special issue of the Journal of Risk and Reliability: Proceedings of the Institute of Mechanical Engineers Part O (Publisher SAGE). Manuscripts submitted to the special issue should be substantial extensions of the original conference papers in order to be independent of the conference proceedings.

Topics of interest for APARM 2014 include, but are not limited to:

Accelerated Life Testing Bayesian Reliability
Communication Systems Computer Systems Reliability
Dependability Modeling Design for Six Sigma
Estimation and Statistical Tests Fault-tolerant Computing
Human Reliability Internet Reliability Engineering
Maintenance Modeling Maintenance Optimization
Network Reliability and Optimization Reliability Physics
Safety and Risk Assessment Security Issues
Software Reliability and Testing Service and Reliability
Systems Reliability Survival Analysis
Cyber Security Warranty Analysis Manufacturing

Journal: http://intl-pio.sagepub.com/
APARM 2014: http://www.aparmnet.org/

September 30, 2014: Submissions due date
January 31, 2015: Revised papers due date from authors
May 1, 2015: Second revision due date from authors
May 15, 2015: Notification of acceptance/rejection of the special issue papers

Authors should submit their manuscripts (as pdf files) through the Journal’s manuscript central website (https://mc.manuscriptcentral.com/jrr) before the submission deadline. In preparing their manuscripts, authors are requested to carefully check the Instructions to Authors on the journal homepage and should follow these instructions completely.  Otherwise, manuscripts may be rejected and returned to the authors without review.

Tadashi Dohi, Dr.
Hiroshima University, Japan
Email: dohi@rel.hiroshima-u.ac.jp

Suk Joo Bae, Dr.
Hanyang University, Korea
Email: sjbae@hanyang.ac.kr

Richard Arnold, Dr.
Victoria University of Wellington, New Zealand
Email: richard.arnold@msor.vuw.ac.nz

John D. Andrews, Professor
The University of Nottingham, UK